Analog Devices Inc.(ADI) MAX4821EUP

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  • Part Number:

    MAX4821EUP

  • Manufacturer:

    Analog Devices Inc.(ADI)

  • Category:

    Display Drivers

  • RoHs:

    rohs Non-RoHS Compliant

  • Datasheet:

    pdf MAX4821EUP_Datesheet

  • Description:

    IC PWR DRIVER N-CHAN 1:8 20TSSOP

  • In stock 0
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Specifications
Type
Paramete
Type
Paramete
Rds On (Typ)
2Ohm
Output Configuration
Low Side
Output Type
N-Channel
Package / Case
20-TSSOP (0.173", 4.40mm Width) Exposed Pad
Qualification
-
Grade
-
Mounting Type
Surface Mount
Voltage - Load
2.3V ~ 5.5V
Current - Output (Max)
70mA
Input Type
-
Features
-
Switch Type
Relay, Solenoid Driver
Number of Outputs
8
Fault Protection
-
Operating Temperature
-40°C ~ 85°C (TA)
Interface
Parallel
Voltage - Supply (Vcc/Vdd)
-
Supplier Device Package
20-TSSOP-EP
Ratio - Input:Output
1:8
Overview

MAX4821EUP Accessories – Model Information


1. Device Overview


ParameterSpecification
ModelMAX4821EUP
Type8-Channel Relay Driver with Parallel Interface
Package20-pin TSSOP (6.4 mm × 4.4 mm, exposed pad)
Interface4-bit parallel (A0–A2, LVL)
Outputs8 open-drain, 70 mA sink each, 2 Ω max RON
Supply2.3 V to 5.5 V (3.3 V / 5 V typical)
Temp Range−40 °C to +85 °C
FeaturesBuilt-in kick-back diodes, SET/RESET global control


2. Recommended External Components (Not Supplied)


ComponentValue / RatingPurposeNotes
VCC bypass0.1 µF ceramic + 10 µF tantalumSupply de-couplingPlace ≤5 mm from pin 19
COM diode railConnected to VCC or external 6 V maxKick-back returnMay be higher than VCC for faster decay
Relay coil3 V or 5 V, ≤70 mA, any inductanceLoadInternal clamp diode handles kick-back
Logic pull-down100 kΩ on A0–A2, LVL if bus floatsNoise immunityOptional – inputs have Schmidt triggers
Thermal padSolder exposed pad to PGND (pins 10,16)Heat-sinkRequired for rated current & θJA = 46 °C/W


3. Pin-Out & Land Pattern (TSSOP-EP)

PinNameFunctionLand (mm)
1RESETGlobal off (active low)0.65 mm pitch, 0.30 mm lead width
2CSLatch strobe
3LVLOn/off for selected channel
4A0Address bit 0
5A1Address bit 1
6A2Address bit 2
7GNDDigital ground
8–15OUT1–OUT8Open-drain relay drivers0.5 A total continuous
13COMCommon of free-wheel diodesTie to coil supply
10,16PGNDPower ground (exposed pad)Solder to solid copper plane
Recommended PCB Footprint
20-pin TSSOP-EP, 6.6 mm × 4.5 mm body, 0.65 mm pitch, exposed pad 2.85 mm × 3.15 mm.
Download from Maxim (now Analog Devices) product page: “Package Outline 21-0108”.


4. Evaluation & Development Hardware


Part NumberDescriptionContentsNotes
MAX4821EVKITEvaluation kitMAX4821EUP+ on small PCB, IDC cable, Windows GUI via USB-SPI bridgeWorks with MAX4820 too (same board, different IC)
MAX4820EVKITAlternative kitPopulated with MAX4820ETP+ (QFN) – same PCBOrder if serial control preferred
Both kits available from Analog Devices web-store or distributors (Digi-Key, Mouser).


5. CAD & Simulation Resources


File TypeFile Name / LocationNotes
Symbol & Footprint“MAX4821EUP” in Ultra-Librarian, SnapEDA, SamacSysVerified 20-TSSOP-EP
IBIS Modelmax4821.ibs (Analog Devices)For signal-integrity simulation
Thermal ModelθJA = 46 °C/W (1 oz, JEDEC 1s), θJC = 2 °C/WUse for 70 mA × 8 chn analysis


6. Compatible Relays (Examples)


ManufacturerSeriesCoil VCoil mAConnectorNotes
OmronG6K-2F-Y3 V50 mA2 Form-CLow-profile, latching option
TE ConnectivityTQ2-5V5 V40 mA2 Form-C2 Ω RON easily drives
PanasonicTX2-3V3 V53 mA2 Form-CHigh sensitivity
Always verify coil current ≤ 70 mA and total continuous power ≤ package rating (1.7 W @ 25 °C).


7. Environmental & Compliance


ItemDetails
RoHSYes (10/10 substances)
REACH251-SVHC compliant
MSLMSL-1 (unlimited floor life)
Lead FinishMatte Sn (100 %), Pb-free
GreenHalogen-free molding compound


8. Ordering & Packaging Information


ParameterValue
Full Orderable PNMAX4821EUP+ (lead-free)
Package Code20-pin TSSOP-EP, 6.4 mm body
Shipping QtyTube: 73 pcs, Tray: 980 pcs
Moisture BagDry-pack not required (MSL-1)
Country of OriginPhilippines (typ.)


9. Quick Reference Summary


CategoryAccessory / Info
DeviceMAX4821EUP – 8-ch parallel relay driver
PCB20-TSSOP-EP footprint (21-0108)
Passive0.1 µF + 10 µF on VCC, 15 pF load on outputs
Relay3 V/5 V, ≤70 mA coil, COM tied to coil supply
EVKITMAX4821EVKIT (USB-parallel GUI)
ModelsIBIS, Altium/SnapEDA library, thermal data
StockDigi-Key, Mouser, Analog Devices web-shop

Note:
All listed accessories and external components are user-supplied unless explicitly included in evaluation kits.
Always solder the exposed pad to a solid ground plane for rated current capability and thermal performance.

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