Texas Instruments(TI) TPS22950CQDDCRQ1


- Part Number:
TPS22950CQDDCRQ1
- Manufacturer:
- Category:
- RoHs:
RoHS Compliant - Datasheet:
TPS22950CQDDCRQ1_Datesheet - Description:
AUTOMOTIVE 5.5-V, 2.7-A, 34-M LO
- In stock 892
TPS22950CQDDCRQ1 Complete Supplementary Datasheet Summary
1. Basic Identification
- Full Part Number: TPS22950CQDDCRQ1
- Device Family: TPS22950‑Q1 Automotive Grade Load Switch
- Status: Active (Production)
- Qualification: AEC‑Q100 Grade 1
- RoHS Compliance: Yes
- Operating Temperature: −40 °C to 125 °C
- Top Marking: 950Q
- Certification: UL 2367 (File No. E169910, 66 mA – 2.46 A)
2. Package & Mechanical Data
- Package Type: SOT‑23‑THIN (DDC)
- Pin Count: 6 pins
- Nominal Body Size: 2.90 mm × 2.80 mm
- Max Height: 1.1 mm
- Thermal Resistance (RθJA): 104.8 °C/W
- MSL Rating: Level 1, 260 °C peak reflow, unlimited floor life
- Lead Finish: SN
3. Packaging & Tape-and-Reel Specifications
3.1 Packaging Configuration
- Standard Pack Quantity (SPQ): 3000 units per reel
- Carrier: Large Tape and Reel (LARGE T&R)
3.2 Reel Dimensions (Nominal)
- Reel Diameter: 180.0 mm
- Reel Width (W1): 8.4 mm
- Carrier Tape Width (W): 8.0 mm
- Cavity Pitch (P1): 4.0 mm
- Cavity Length (A0): 3.2 mm
- Cavity Width (B0): 3.2 mm
- Cavity Height (K0): 1.4 mm
- Pin 1 Quadrant: Q3
3.3 Reel Box Dimensions (Nominal)
- Length: 210.0 mm
- Width: 185.0 mm
- Height: 35.0 mm
4. Absolute Maximum Ratings
- VIN, VOUT, VON, VFLT: −0.3 V to 6 V
- Continuous Output Current (IMAX): 2.7 A
- Pulsed Output Current (IMAX,PLS): 4.1 A (TJ = 85 °C, 2% duty cycle)
- Storage Temperature (TSTG): −65 °C to 150 °C
- Lead Soldering Temp (10 s): 300 °C
5. Recommended Operating Conditions
- Input Voltage (VIN): 1.8 V – 5.5 V
- Output Voltage (VOUT): 0 V – 5.5 V
- Current Limit (ILIM): 0.05 A – 3.5 A (typ)
- Ambient Temp (TA): −40 °C – 125 °C
- Junction Temp (TJ): −40 °C – 150 °C
- ON Pin High (VIH): 1 V – 5.5 V
- ON Pin Low (VIL): 0 V – 0.35 V
6. Key Electrical Characteristics
6.1 Supply Current
- Quiescent Current (IQ): 40 µA typ (ON, VIN = 5 V)
- Shutdown Current (ISD): 0.2 µA typ (OFF, 25 °C)
6.2 ON‑Resistance (RON)
- VIN = 5 V: 34 mΩ typ, 41 mΩ max
- VIN = 3.3 V: 41 mΩ typ, 51 mΩ max
- VIN = 1.8 V: 65 mΩ typ, 90 mΩ max
6.3 Current Limit (ILIM)
- Adjustable via external resistor to GND: ILIM = 1.18 × (RILIM)⁻¹·⁰⁷²
- Response time (tLIM): 5 µs typ
6.4 Reverse Current Blocking (RCB)
- Activation threshold: 44 mV typ (VOUT > VIN)
- Release threshold: 16 mV typ
- Response time (tRCB): 3 µs typ
6.5 Fault Indicator (FLT)
- Open‑drain, low in fault
- VOL, FLT: 0.1 V max at IFLT = 1 mA
6.6 Quick Output Discharge (QOD)
- 130 Ω typ (VIN = 5 V, OFF state)
6.7 Thermal Shutdown (TSD)
- Trigger: 170 °C (rising)
- Release: 150 °C (falling, hysteresis)
7. Switching Characteristics (Typical, 25 °C)
- tON (Turn‑on Time):
- tR (Rise Time):
- tOFF (Turn‑off Time):
- tFALL (Fall Time): ~118–130 µs
- Output Delay (tD): 415 µs (all VIN)
8. Pin Configuration (6‑Pin DDC SOT, Top View)
表格
| Pin No. | Name | Type | Description |
|---|---|---|---|
| 1 | ON | Input | Active‑high enable; do not float |
| 2 | VIN | Power | Supply input |
| 3 | GND | Ground | Device ground |
| 4 | ILIM | I/O | Current‑limit adjust (resistor to GND) |
| 5 | VOUT | Power | Switch output |
| 6 | FLT | Output | Open‑drain fault signal |
9. Core Features
- Adjustable output current limit (0.05 A – 3.5 A)
- Always‑ON true reverse current blocking (RCB)
- Thermal shutdown with hysteresis
- Open‑drain fault indication (FLT)
- Smart ON‑pin pulldown (prevents floating)
- Slow turn‑on to minimize inrush current
- Quick output discharge (QOD) when disabled
- Ultra‑low quiescent and shutdown current
10. Typical Applications
- Automotive infotainment & cluster head units
- Automotive dashboard displays
- ADAS surround‑view ECUs
- Body control modules & gateways
11. Reliability & Handling
- ESD Rating: HBM ±2000 V; CDM ±500 V
- ESD Caution: Use proper ESD protection during handling
- Junction Temperature: −40 °C to 150 °C
12. Layout Guidelines
- Place RILIM close to ILIM pin and minimize ground loop
- Input/output capacitors near device to reduce parasitics
- Wide copper traces for VIN, VOUT, GND to improve thermal dissipation
- Minimize AC current loop area to reduce noise
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