Infineon Technologies BSP129L6906

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Specifications
Type
Paramete
Type
Paramete
Operating Temperature
-55°C ~ 150°C (TJ)
Drive Voltage (Max Rds On, Min Rds On)
0V, 10V
Gate Charge (Qg) (Max) @ Vgs
5.7 nC @ 5 V
Supplier Device Package
PG-SOT223-4-21
Grade
-
Package / Case
TO-261-4, TO-261AA
Power Dissipation (Max)
1.8W (Ta)
Current - Continuous Drain (Id) @ 25°C
350mA (Ta)
Vgs(th) (Max) @ Id
1V @ 108µA
Technology
MOSFET (Metal Oxide)
Input Capacitance (Ciss) (Max) @ Vds
108 pF @ 25 V
Vgs (Max)
±20V
Rds On (Max) @ Id, Vgs
6Ohm @ 350mA, 10V
Drain to Source Voltage (Vdss)
240 V
FET Type
N-Channel
FET Feature
Depletion Mode
Mounting Type
Surface Mount
Qualification
-
Overview

BSP129L6906 Model Information

Part Number: BSP129L6906

Manufacturer: Infineon Technologies AG

Product Line: SIPMOS® Small-Signal-Transistor

Package Type: PG-SOT223

Marking: BSP129


Key Features

  • N-Channel
  • Depletion Mode
  • dv/dt Rated
  • Available with VGS(th) Indicator on Reel
  • Pb-Free Lead Plating; RoHS Compliant
  • Qualified According to AEC Q101
  • Halogen-Free According to IEC61249-2-21


Maximum Ratings (at Tj = 25°C, unless otherwise specified)

  • Continuous Drain Current (ID):TA = 25°C: 0.35 ATA = 70°C: 0.28 A
  • Pulsed Drain Current (ID,pulse): 1.4 A (TA = 25°C)
  • Reverse Diode dv/dt: 6 kV/µs (ID = 0.36 A, VDS = 192 V, di/dt = 200 A/µs, Tj,max = 150°C)
  • Gate-Source Voltage (VGS): ±20 V
  • ESD Class (JESD22-A114-HBM): 1A (>250V, <500V)
  • Power Dissipation (Ptot): 1.8 W (TA = 25°C)
  • Operating and Storage Temperature (Tj, Tstg): -55°C to +150°C


Thermal Characteristics

  • Thermal Resistance, Junction - Soldering Point (pin 4) (RθJS): 25 K/W
  • Thermal Resistance, Junction - Ambient (RθJA):SMD Version, Device on PCB, Minimal Footprint: 115 K/W6 cm² Cooling Area: 70 K/W


Electrical Characteristics (at Tj = 25°C, unless otherwise specified)

Static Characteristics

  • Drain-Source Breakdown Voltage (V(BR)DSS): 240 V (VGS = -3 V, ID = 250 µA)
  • Gate Threshold Voltage (VGS(th)): -2.1 V to -1 V (VDS = 3 V, ID = 108 µA)
  • Drain-Source Cutoff Current (ID(off)):VDS = 240 V, VGS = -3 V, Tj = 25°C: 0.1 µAVDS = 240 V, VGS = -3 V, Tj = 125°C: 10 µA
  • Gate-Source Leakage Current (IGSS): 10 nA (VGS = 20 V, VDS = 0 V)
  • On-State Drain Current (IDSS): 50 mA (VGS = 0 V, VDS = 10 V)
  • Drain-Source On-State Resistance (RDS(on)):VGS = 0 V, ID = 25 mA: 6.5 Ω to 20 ΩVGS = 10 V, ID = 0.35 A: 4.2 Ω to 6.0 Ω
  • Transconductance (gm): 0.18 S to 0.36 S (|VDS| > 2|ID|RDS(on)max, ID = 0.28 A)

Dynamic Characteristics

  • Input Capacitance (Ciss): 82 pF to 108 pF
  • Output Capacitance (Coss): 12 pF to 16 pF
  • Reverse Transfer Capacitance (Crss): 6 pF to 10 pF
  • Turn-On Delay Time (td(on)): 4.4 ns to 6.6 ns
  • Rise Time (tr): 4.1 ns to 6.2 ns
  • Turn-Off Delay Time (td(off)): 22 ns to 33 ns
  • Fall Time (tf): 35 ns to 53 ns

Gate Charge Characteristics

  • Gate to Source Charge (Qgs): 0.24 nC to 0.36 nC
  • Gate to Drain Charge (Qgd): 1.7 nC to 2.6 nC
  • Gate Charge Total (Qg): 3.8 nC to 5.7 nC
  • Gate Plateau Voltage (Vplateau): 0.37 V


Reverse Diode Characteristics

  • Diode Continuous Forward Current (IS): 0.35 A
  • Diode Pulse Current (IS,pulse): 1.4 A
  • Diode Forward Voltage (VSD): 0.79 V to 1.2 V (VGS = -3 V, IF = 0.35 A, Tj = 25°C)
  • Reverse Recovery Time (trr): 53 ns to 80 ns
  • Reverse Recovery Charge (Qrr): 65 nC to 97 nC (VR = 120 V, IF = 0.2 A, diF/dt = 100 A/µs)


Threshold Voltage Bands

  • J Band: -1.2 V to -1 V
  • K Band: -1.35 V to -1.15 V
  • L Band: -1.5 V to -1.3 V
  • M Band: -1.65 V to -1.45 V
  • N Band: -1.8 V to -1.6 V


Package Outline

  • Package Type: PG-SOT223
  • Dimensions:A: 0.90 mm to 1.20 mmA1: 0.15 mm to 0.35 mmD: 4.80 mm to 5.35 mmD1: 0.03 mm to 0.23 mmE: 5.70 mmE1: 5.90 mm to 6.10 mm


Packaging

  • Tape and Reel Marking: BSP129
  • Packaging Quantity:L6906: 1000 pcs/reel
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