Product Information Summary for BAS70-04 and BAS235

BAS70-04 General-Purpose Dual Schottky Diode

• General DescriptionGeneral-purpose dual Schottky diode in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package.
• Features and BenefitsHigh switching speed.Low leakage current.High breakdown voltage.Low capacitance.
• ApplicationsUltra high-speed switching.Voltage clamping.
• Quick Reference DataParameter | Conditions | Min | Typ | Max | UnitForward current (IF) | - | - | 70 | - | mAForward voltage (VF) | IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C | - | 410 | - | mVReverse voltage (VR) | T = 25 °C | - | 70 | - | V
• Pinning InformationPin | Symbol | Description1 | A1 | Anode (diode 1)2 | K2 | Cathode (diode 2)3 | K1; A2 | Cathode 1; Anode 2
• Ordering InformationPackage Type | Name | DescriptionSOT23 | BAS70-04 | Plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body
• Marking CodesType Number | Marking CodeBAS70-04 | 74%
• Limiting ValuesParameter | Conditions | Min | Max | UnitReverse voltage (VR) | T = 25 °C | - | 70 | VForward current (IF) | - | - | 70 | mARepetitive peak forward current (IFRM) | tp ≤ 1 s; δ ≤ 0.5 | - | 70 | mANon-repetitive peak forward current (IFSM) | tp ≤ 10 ms; Tj(init) = 25 °C | - | 100 | mAJunction temperature (Tj) | - | - | 150 | °CAmbient temperature (Tamb) | - | -65 | 150 | °CStorage temperature (Tstg) | - | -65 | 150 | °C
• Thermal CharacteristicsParameter | Conditions | Min | Typ | Max | UnitThermal resistance from junction to ambient (Rth(j-a)) | in free air | - | 500 | - | K/W
• CharacteristicsParameter | Conditions | Min | Typ | Max | UnitForward voltage (VF) | IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C | - | 410 | - | mVForward voltage (VF) | IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C | - | 750 | - | mVForward voltage (VF) | IF = 15 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C | - | 1 | - | VReverse current (IR) | VR = 50 V; Tamb = 25 °C | - | 100 | - | nAReverse current (IR) | VR = 70 V; Tamb = 25 °C | - | 10 | - | µADiode capacitance (Cd) | VR = 0 V; f = 1 MHz; Tamb = 25 °C | - | 2 | - | pF
• Package OutlineDimensions in mm are provided in Fig. 5.
• SolderingReflow soldering footprint for SOT23 is provided in Fig. 6.Wave soldering footprint for SOT23 is provided in Fig. 7.
• Revision HistoryData Sheet ID | Release Date | Data Sheet Status | Change Notice | SupersedesBAS70-04 v.11 | 20230101 | Product data sheet | Family data sheet reduced to single type data sheets. Product changed to non-automotive qualification. | BAS70_1PS7XSB70_SER_10