Vishay BZG05C5V1TR3

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Specifications
Type
Paramete
Type
Paramete
Supplier Device Package
DO-214AC (SMA)
Mounting Type
Surface Mount
Package / Case
DO-214AC, SMA
Tolerance
-
Voltage - Forward (Vf) (Max) @ If
1.2 V @ 200 mA
Current - Reverse Leakage @ Vr
1 µA @ 1.5 V
Impedance (Max) (Zzt)
10 Ohms
Qualification
-
Grade
-
Power - Max
1.25 W
Voltage - Zener (Nom) (Vz)
5.1 V
Operating Temperature
150°C
Overview

BZG05C5V1TR3 Specification Summary

Basic Information

  • Manufacturer: Vishay Semiconductors
  • Product Series: BZG05C-Series

Ordering Information

  • Device Name: BZG05C5V1
  • Ordering Code: BZG05C5V1TR3
  • Packaging: 13" reel
  • Units per Reel: 6000
  • Minimum Order Quantity: 6000/box

Features

  • High Reliability: Ensures stable performance in various applications.
  • Voltage Range: Nominal 5.1 V, with a range of 4.8 V to 5.4 V.
  • SMD Compatibility: Fits onto 5 mm SMD footpads, suitable for surface-mount technology.
  • Solderability: Wave and reflow solderable, facilitating diverse manufacturing processes.
  • AEC-Q101 Qualified: Available in AEC-Q101 qualified versions for automotive applications.
  • RoHS Compliance: Compliant with environmental regulations.
  • Material Compliance: For detailed definitions of compliance, refer to Vishay's documentation.

Primary Characteristics

  • Zener Voltage (VZ): Nominal 5.1 V, with a range of 4.8 V to 5.4 V.
  • Test Current (IZT): 45 mA.
  • Reverse Breakdown Voltage (VBR): 5.2 V to 95 V.
  • Working Voltage (VWM): 4.7 V to 90 V.
  • Peak Pulse Power (PPPM): 40 W.
  • Maximum Junction Temperature (TJ max.): 150 °C.
  • Polarity: Uni-directional.
  • Construction: Single internal construction.

Electrical Characteristics (at Tamb = 25 °C)

  • Zener Voltage (VZ): 4.8 V (min.), 5.1 V (nom.), 5.4 V (max.) at 45 mA test current.
  • Reverse Leakage Current (IR): 1.5 μA at 5.1 V reverse voltage.
  • Dynamic Resistance (ZZ): 10 Ω at 45 mA test current.
  • Temperature Coefficient (TCVZ): -0.01 %/K to 0.04 %/K.

Absolute Maximum Ratings (at Tamb = 25 °C, unless otherwise specified)

  • Power Dissipation (Ptot):3000 mW at RthJA < 30 K/W and Tamb = 60 °C.1250 mW at RthJA < 100 K/W and Tamb = 25 °C.
  • Non-Repetitive Peak Surge Power Dissipation (PZSM): 60 W at tp = 100 μs square pulse and T = 25 °C prior to surge.
  • Junction to Lead Thermal Resistance (RthJL): 30 K/W.
  • Junction to Ambient Air Thermal Resistance (RthJA):150 K/W when mounted on epoxy-glass hard tissue (fig. 1a).125 K/W when mounted on epoxy-glass hard tissue (fig. 1b).100 K/W when mounted on Al-oxid-ceramic (Al2O3) (fig. 1b).
  • Maximum Junction Temperature (Tj): 150 °C.
  • Storage Temperature Range (Tstg): -65 °C to +150 °C.
  • Forward Voltage (VF): 1.2 V (max.) at IF = 0.2 A.

Package Information

  • Package Name: DO-214AC
  • Weight: 77 mg
  • Molding Compound Flammability Rating: UL 94 V-0
  • Moisture Sensitivity Level: MSL level 1 (according to J-STD-020)
  • Soldering Conditions: 260 °C/10 s at terminals

Package Dimensions (in millimeters)

  • Footprint Recommendation:Length: 4.2 mm (0.164 in)Width: 2.0 mm (0.078 in)Height: 2.5 mm (0.098 in)Lead Length: 2.3 mm (0.090 in)Lead Width: 1.4 mm (0.055 in)Lead Thickness: 0.1 mm (0.004 in)Body Length: 2.8 mm (0.109 in)Body Width: 1.7 mm (0.066 in)Body Height: 3.3 mm (0.130 in)Reference Dimensions: 6.7 mm (0.264 in) for reference
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