PCA9615DPZ Product Information

Overview

The PCA9615DPZ is a variant of the PCA9615, a 2-channel multipoint Fast-mode Plus differential I2C-bus buffer with hot-swap logic. This device is designed to extend the normal single-ended SMBus/I2C-bus through electrically noisy environments using a differential SMBus/I2C-bus (dI2C) physical layer. It is ideal for applications requiring long I2C-bus runs in high-noise environments.

Key Features

• Differential I2C-bus Buffering: Converts single-ended I2C-bus signals to differential signals, enhancing noise resistance and allowing longer cable runs.
• Hot-Swap Capability: Enables safe insertion or removal of modules without disrupting the bus.
• High-Speed Operation: Supports bus speeds up to 1 MHz.
• Extended Cable Length: Capable of extending cables up to 3 meters or longer at lower clock speeds.
• Compatibility: Compatible with Standard, Fast-mode, and Fast-mode Plus I2C-bus devices.
• ESD Protection: Exceeds 2000 V HBM and 1000 V CDM.
• Package Type: TSSOP10 (10-lead plastic thin shrink small outline package).

Ordering Information

• Package Type: TSSOP10
• Orderable Part Number: PCA9615DPZ
• Packing Method: Reel 13" Q1/T1, Static Shielding Bag (SSB)
• Minimum Order Quantity: 2500
• Temperature Range: Tamb = –40 °C to +85 °C

Applications

• Harsh Environment Monitoring: Suitable for remote temperature/leak detectors in harsh environments.
• Power Supply Control: Ideal for controlling power supplies in high-noise environments.
• Equipment Cabinet Communication: Facilitates I2C-bus transmission between equipment cabinets.
• Industrial Control: Used in commercial lighting and industrial heating/cooling control systems.
• Long I2C-bus Runs: Suitable for applications requiring long I2C-bus runs in electrically noisy environments.

Technical Specifications

• Supply Voltage Range: VDD(A) 2.3 V to 5.5 V, VDD(B) 3.0 V to 5.5 V
• Operating Temperature: -40 °C to +85 °C
• Differential Output Voltage: ±200 mV sensitivity, ±30 mV hysteresis
• Propagation Delay:LOW to HIGH: 120 ns (typical)HIGH to LOW: 150 ns (typical)
• Power Dissipation: 100 mW

Package Outline

• Package Type: TSSOP10
• Dimensions:Body Width: 3 mmLead Pitch: 0.5 mmOverall Length: 5.0 mm

Soldering Information

• Soldering Method: Suitable for reflow soldering.
• Reflow Temperature Profile:SnPb Eutectic Process: 235 °C (peak)Lead-Free Process: 260 °C (peak)

Additional Information

• Hot Swap Sequence:Power-On Reset: 1 ms for power stabilization, 10 ms for plug-in debouncing.Connection Established: After detecting bus idle/stop condition.
• ESD Protection: Exceeds industry standards, ensuring robustness in noisy environments.