Vishay SI7431DP-T1-GE3

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  • Part Number:

    SI7431DP-T1-GE3

  • Manufacturer:

    Vishay

  • Category:

    Single, Pre-Biased Bipolar Transistors

  • RoHs:

    rohs RoHS Compliant

  • Datasheet:

    pdf SI7431DP-T1-GE3_Datesheet

  • Description:

    MOSFET P-CH 200V 2.2A PPAK SO-8

  • In stock 6,981
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Specifications
Type
Paramete
Type
Paramete
Qualification
-
Drive Voltage (Max Rds On, Min Rds On)
6V, 10V
Operating Temperature
-55°C ~ 150°C (TJ)
Drain to Source Voltage (Vdss)
200 V
Package / Case
PowerPAK® SO-8
Input Capacitance (Ciss) (Max) @ Vds
-
Vgs (Max)
±20V
Rds On (Max) @ Id, Vgs
174mOhm @ 3.8A, 10V
Vgs(th) (Max) @ Id
4V @ 250µA
FET Type
P-Channel
Power Dissipation (Max)
1.9W (Ta)
Technology
MOSFET (Metal Oxide)
Supplier Device Package
PowerPAK® SO-8
FET Feature
-
Current - Continuous Drain (Id) @ 25°C
2.2A (Ta)
Grade
-
Mounting Type
Surface Mount
Gate Charge (Qg) (Max) @ Vgs
135 nC @ 10 V
Overview

SI7431DP‑T1‑GE3 – Complete Datasheet Summary


1. Basic Identification


  • Full Part Number: SI7431DP‑T1‑GE3
  • Manufacturer: Vishay Siliconix
  • Device Type: P‑Channel TrenchFET® Power MOSFET
  • Package: PowerPAK® SO‑8 (leadless, low‑profile 1.07 mm)
  • Compliance: RoHS compliant, halogen‑free, lead‑free
  • Document: Rev. G, 12‑Dec‑2022, Doc. #: 73116
  • Marking: Single P‑channel, 200 V rating

2. Key Features


  • Ultra‑low RDS(on) for high‑efficiency switching
  • Low thermal resistance PowerPAK package
  • 100% tested for gate resistance (Rg) and avalanche ruggedness
  • Logic‑level compatible drive
  • Ideal for space‑constrained designs
  • Halogen‑free & green molding compound

3. Absolute Maximum Ratings (TA = 25°C)


ParameterSymbolValueUnit
Drain–Source VoltageVDS−200V
Gate–Source VoltageVGS±20V
Continuous Drain Current @ TA = 25°CID−3.8A
Continuous Drain Current @ TA = 70°CID−3.0A
Pulsed Drain CurrentIDM−30A
Single Avalanche EnergyEAS11mJ
Max. Power Dissipation @ TA = 25°CPD5.4W
Operating / Storage TempTJ, Tstg−55 to +150°C
Soldering Peak Temp260°C

4. Thermal Characteristics


ParameterSymbolTypMaxUnit
Junction‑to‑Case (steady)RthJC1.01.5°C/W
Junction‑to‑Ambient (steady)RthJA5065°C/W
Junction‑to‑Ambient (≤10 s pulse)RthJA1823°C/W

5. Electrical Specifications (TJ = 25°C)


Static Electrical

ParameterConditionsMinTypMaxUnit
Drain–Source Breakdown VoltageVGS = 0 V, ID = −250 µA−200V
Gate Threshold VoltageVDS = VGS, ID = −250 µA−2.0−4.0V
Zero‑Gate Drain LeakageVDS = −200 V, VGS = 0 V−1µA
On‑State ResistanceVGS = −10 V, ID = −3.8 A0.1450.174Ω
On‑State ResistanceVGS = −6 V, ID = −3.6 A0.1470.180Ω
Forward TransconductanceVDS = −15 V, ID = −3.8 A17S
Body Diode Forward VoltageIS = −4.2 A, VGS = 0 V−0.78−1.2V

Dynamic Electrical

ParameterConditionsTypMaxUnit
Total Gate ChargeVGS = −10 V135nC
Gate–Source Charge16.5nC
Gate–Drain Charge25nC
Turn‑On DelayVDD = −75 V, ID ≈ −4.8 A2340ns
Rise Time4975ns
Turn‑Off Delay110180ns
Fall Time66100ns
Reverse Recovery TimeIF = −2.9 A120ns

6. Package & Pinout (PowerPAK SO‑8)


  • Package Dimensions: 6.15 × 5.15 × 1.07 mm
  • Pin Assignment:

7. Typical Applications


  • Active clamp circuits
  • Intermediate DC/DC converters
  • High‑side P‑channel switching
  • Low‑profile power management
  • Industrial & consumer power systems

8. Ordering Explanation


  • SI7431DP: Base part number
  • T1: Tape‑and‑reel packaging
  • GE3: Halogen‑free + lead‑free (RoHS)


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