Vishay SI7431DP-T1-GE3


- Part Number:
SI7431DP-T1-GE3
- Manufacturer:
- Category:
- RoHs:
RoHS Compliant - Datasheet:
SI7431DP-T1-GE3_Datesheet - Description:
MOSFET P-CH 200V 2.2A PPAK SO-8
- In stock 6,981
SI7431DP‑T1‑GE3 – Complete Datasheet Summary
1. Basic Identification
- Full Part Number: SI7431DP‑T1‑GE3
- Manufacturer: Vishay Siliconix
- Device Type: P‑Channel TrenchFET® Power MOSFET
- Package: PowerPAK® SO‑8 (leadless, low‑profile 1.07 mm)
- Compliance: RoHS compliant, halogen‑free, lead‑free
- Document: Rev. G, 12‑Dec‑2022, Doc. #: 73116
- Marking: Single P‑channel, 200 V rating
2. Key Features
- Ultra‑low RDS(on) for high‑efficiency switching
- Low thermal resistance PowerPAK package
- 100% tested for gate resistance (Rg) and avalanche ruggedness
- Logic‑level compatible drive
- Ideal for space‑constrained designs
- Halogen‑free & green molding compound
3. Absolute Maximum Ratings (TA = 25°C)
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Drain–Source Voltage | VDS | −200 | V |
| Gate–Source Voltage | VGS | ±20 | V |
| Continuous Drain Current @ TA = 25°C | ID | −3.8 | A |
| Continuous Drain Current @ TA = 70°C | ID | −3.0 | A |
| Pulsed Drain Current | IDM | −30 | A |
| Single Avalanche Energy | EAS | 11 | mJ |
| Max. Power Dissipation @ TA = 25°C | PD | 5.4 | W |
| Operating / Storage Temp | TJ, Tstg | −55 to +150 | °C |
| Soldering Peak Temp | — | 260 | °C |
4. Thermal Characteristics
| Parameter | Symbol | Typ | Max | Unit |
|---|---|---|---|---|
| Junction‑to‑Case (steady) | RthJC | 1.0 | 1.5 | °C/W |
| Junction‑to‑Ambient (steady) | RthJA | 50 | 65 | °C/W |
| Junction‑to‑Ambient (≤10 s pulse) | RthJA | 18 | 23 | °C/W |
5. Electrical Specifications (TJ = 25°C)
Static Electrical
| Parameter | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Drain–Source Breakdown Voltage | VGS = 0 V, ID = −250 µA | −200 | — | — | V |
| Gate Threshold Voltage | VDS = VGS, ID = −250 µA | −2.0 | — | −4.0 | V |
| Zero‑Gate Drain Leakage | VDS = −200 V, VGS = 0 V | — | — | −1 | µA |
| On‑State Resistance | VGS = −10 V, ID = −3.8 A | — | 0.145 | 0.174 | Ω |
| On‑State Resistance | VGS = −6 V, ID = −3.6 A | — | 0.147 | 0.180 | Ω |
| Forward Transconductance | VDS = −15 V, ID = −3.8 A | — | 17 | — | S |
| Body Diode Forward Voltage | IS = −4.2 A, VGS = 0 V | — | −0.78 | −1.2 | V |
Dynamic Electrical
| Parameter | Conditions | Typ | Max | Unit |
|---|---|---|---|---|
| Total Gate Charge | VGS = −10 V | — | 135 | nC |
| Gate–Source Charge | — | 16.5 | — | nC |
| Gate–Drain Charge | — | 25 | — | nC |
| Turn‑On Delay | VDD = −75 V, ID ≈ −4.8 A | 23 | 40 | ns |
| Rise Time | — | 49 | 75 | ns |
| Turn‑Off Delay | — | 110 | 180 | ns |
| Fall Time | — | 66 | 100 | ns |
| Reverse Recovery Time | IF = −2.9 A | — | 120 | ns |
6. Package & Pinout (PowerPAK SO‑8)
- Package Dimensions: 6.15 × 5.15 × 1.07 mm
- Pin Assignment:
7. Typical Applications
- Active clamp circuits
- Intermediate DC/DC converters
- High‑side P‑channel switching
- Low‑profile power management
- Industrial & consumer power systems
8. Ordering Explanation
- SI7431DP: Base part number
- T1: Tape‑and‑reel packaging
- GE3: Halogen‑free + lead‑free (RoHS)
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