Product Identification Information for IS21ES64G-JQLI

Device:

• IS21ES64G: 64GB eMMC with eMMC 5.0 Interface

Package:

• 100-ball FBGA (Q): 100-ball Fine Ball Grid ArrayDimensions: 14.0 mm x 18.0 mm x 1.4 mm

Operating Temperature Range:

• Industrial Grade: -40°C to +85°C

RoHS Compliance:

• Yes: Complies with RoHS standards

Ordering Information:

• Base Part Number: IS21ES64G
• Density: 64GB
• Interface: eMMC 5.0
• NAND Flash: MLC NAND
• Package: 100-ball FBGA
• Temperature Grade: Industrial (-40°C to +85°C)
• Option: Standard (Boot Partition Size: 4MB)
• Generation: 1st Gen. eMMC
• Product Family: 21 = Managed NAND
• Technology: E = ISSI eMMC with MLC NAND
• Full Part Number: IS21ES64G-JQLI

Additional Information:

• Boot Partition Size: 4MB
• RPMB Partition Size: 4MB
• User Density: 62,545,461,248 Bytes

Package Type Information:

• 100-ball FBGA (Q): 100-ball Fine Ball Grid ArrayBall Pitch: 1.27 mmBall Diameter: 0.5 mmPackage Height: 1.4 mm

Ordering Information:

• Orderable Part Number: IS21ES64G-JQLI
• Status: Active
• Material Type: Production

Notes:

• The part number IS21ES64G-JQLI indicates that this device is designed for industrial applications with a temperature range of -40°C to +85°C.
• The device is RoHS compliant, ensuring it meets environmental and safety standards.
• The 100-ball FBGA package is suitable for applications requiring a compact and reliable storage solution.