Micron Technology Inc. MT25QU256ABA1EW9-0SIT

View All Display Drivers by Micron Technology Inc.

Part Number:
MT25QU256ABA1EW9-0SIT
Manufacturer:
Micron Technology Inc.
Category:
Display Drivers
RoHs:
RoHS Compliant
Datasheet:
Description:
IC FLASH 256MBIT SPI 8WPDFN
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Specifications

Type

Paramete

Type

Paramete

Memory Size

256Mbit

Write Cycle Time - Word, Page

8ms, 2.8ms

Memory Format

FLASH

Memory Interface

SPI - Quad I/O

Technology

FLASH - NOR

Memory Organization

32M x 8

Package / Case

8-WDFN Exposed Pad

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Grade

Memory Type

Non-Volatile

Supplier Device Package

8-WPDFN (8x6) (MLP8)

Access Time

Clock Frequency

133 MHz

Qualification

Voltage - Supply

1.7V ~ 2V

Overview

MT25QU256ABA1EW9-0SIT – Comprehensive Datasheet Summary

1. Basic Device Information

Part Number: MT25QU256ABA1EW9-0SIT
Manufacturer: Micron Technology
Product Type: 3V Multiple I/O Serial NOR Flash Memory
Density: 256 Mb (32 MB)
Organization: 64M × 4-bit
Status: Active (Production)
RoHS / Green: Compliant (Lead-free, halogen-free)
ESD Class: Class 1A
MSL Level: MSL 3 (168 hours)
Document Revision: Refer to MT25Q/MT25QL 256Mb datasheet (Rev I, updated 2024)

2. Key Features

High-speed SPI, Dual SPI, Quad SPI interface
Up to 133 MHz clock frequency
Execute-in-Place (XIP) support for direct code execution
Advanced write protection & sector lock features
Flexible sector / block erase architecture
Low power consumption
Internal HOLD# / RESET# function (DQ3 control)
Robust reliability: high endurance & long data retention

3. Electrical Specifications

Parameter	Min	Typ	Max	Unit
Supply Voltage (VCC)	2.7	3.0 / 3.3	3.6	V
Max Operating Frequency	—	—	133	MHz
Active Read Current	—	—	35	mA
Program Current	—	—	35	mA
Page Program Time	—	—	1.8	ms
Sector Erase Time	—	—	1	sec
Endurance	100,000	—	—	cycles
Data Retention	—	20	—	years

4. Absolute Maximum Ratings

VCC: −0.5 V to +4.0 V
Voltage on any I/O: −0.5 V to VCC + 0.5 V
Storage Temperature: −65 °C to +150 °C
Operating Temperature: −40 °C to +85 °C
ESD (HBM): 250 V

5. Package & Mechanical Data

Package: 8‑pin W‑PDFN with Exposed Pad (EP)
Dimensions: 8.00 mm × 6.00 mm × 0.80 mm
Pin Count: 8
Packaging: Tape and reel
Reel Quantity: 4000 units
Dry Pack Qty: 1920 units
Mounting: Surface‑mount (SMT)
Exposed Pad: Internally tied to VSS; connect to GND

6. Pin Definitions (8‑Pin W‑PDFN)

Pin	Symbol	Description
1	S#	Chip Select (active low)
2	DQ0	Serial I/O 0
3	DQ1	Serial I/O 1
4	VSS	Ground
5	DQ2	Serial I/O 2
6	DQ3	Serial I/O 3 / HOLD# / RESET#
7	VCC	Power Supply
8	CLK	Serial Clock
EP	Exposed Pad	Connect to VSS (GND)

7. Memory Architecture

Page Size: 256 Bytes
Sector Size: 4 kB
Block Size: 64 kB
Uniform / Flexible Erase: Sector / Block / Chip erase
Boot Block: Supported
OTP Security Area: Available

8. Supported Interface Modes

Standard SPI (1‑I/O)
Dual SPI (2‑I/O)
Quad SPI (4‑I/O)
High‑speed read commands for fast fetch
XIP mode for direct code execution

9. Operating Temperature Range

Industrial: −40 °C to +85 °C

10. Typical Applications

Embedded system firmware storage
IoT & wireless module code storage
Consumer electronics
Industrial controllers
Automotive infotainment & body modules
Execute-in-Place (XIP) MCU systems
Data logging & configuration storage

11. Reliability & Quality

RoHS / Reach compliant
MSL 3: 168‑hour floor life
JEDEC standard qualification
100k program/erase cycles
20‑year data retention at 85 °C

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