BAT721C,215 Device Information Summary

Basic Information

• Manufacturer: Nexperia
• Device Name: BAT721C,215
• Type: 40 V, 200 mA Schottky Barrier Dual Diode

Ordering Information

• Part Number: BAT721C,215
• Package: SOT23 plastic, surface-mounted package
• Terminals: 3 terminals
• Pitch: 1.9 mm
• Body Dimensions: 2.9 mm x 1.3 mm x 1.0 mm

Features and Benefits

• Low Forward Voltage: Ensures minimal power loss during operation.
• Low Capacitance: Suitable for high-speed applications.

Applications

• Ultra High-Speed Switching: Ideal for applications requiring rapid switching.
• Line Termination: Used to terminate transmission lines.
• Voltage Clamping: Protects circuits from voltage spikes.
• Reverse Polarity Protection: Prevents damage from reverse voltage.

Pinning Information

• Pin 1 (A1): Anode (Diode 1)
• Pin 2 (A2): Anode (Diode 2)
• Pin 3 (K1, K2): Common Cathode

Marking

• Marking Code: L9% (where % is a placeholder for the manufacturing site code)

Limiting Values (Absolute Maximum Ratings)

• Reverse Voltage (VR): 40 V
• Forward Current (IF): 200 mA
• Non-Repetitive Peak Forward Current (IFSM): 1 A (half sine-wave pulse; tp ≤ 8.3 ms; JEDEC method; Tj(init) = 25 °C)
• Junction Temperature (Tj): 125 °C
• Ambient Temperature (Tamb): -65 to +150 °C
• Storage Temperature (Tstg): -65 to +150 °C

Thermal Characteristics

• Thermal Resistance (Rth(j-a)): 500 K/W (in free air, mounted on an FR4 PCB with single-sided copper, tin-plated and standard footprint)

Electrical Characteristics

• Forward Voltage (VF)300 mV (IF = 10 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C)420 mV (IF = 100 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C)550 mV (IF = 200 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C)
• Reverse Current (IR)15 µA (VR = 30 V; Tamb = 25 °C)3 mA (VR = 30 V; Tj = 100 °C)
• Diode Capacitance (Cd)40 to 50 pF (VR = 0 V; f = 1 MHz; Tamb = 25 °C)

Package Outline

• Dimensions in mm:Length: 3.0 mmWidth: 1.4 mmHeight: 1.1 mmLead Length: 0.9 mmLead Width: 0.45 mmLead Thickness: 0.15 mm

Soldering Information

• Reflow Soldering Footprint:Solder Lands: 0.5 mm (3×)Solder Resist: 0.6 mm (3×)Occupied Area: 0.6 mm (3×)Solder Paste: 0.7 mm (3×)
• Wave Soldering Footprint:Solder Lands: 2.8 mmSolder Resist: 4.5 mmOccupied Area: 1.4 mm (2×)Preferred Transport Direction: 2.2 mm (2×)

Revision History

• Version 8 (2024-10-08): Product changed to non-automotive qualification. Refer to nexperia.com for automotive (-Q) product alternatives.
• Version 7 (2022-10-01): Preliminary data sheet release.
• Version 6 (2006-12-21): Previous version release.
• Version 5 (2006-02-05): Previous version release.
• Version 4 (2004-03-15): Previous version release.
• Version 3 (2004-01-26): Previous version release.

Legal Information

• Limited Warranty and Liability: Nexperia provides no representations or warranties for the information in this document and shall have no liability for its use.
• Right to Make Changes: Nexperia reserves the right to make changes to the information published in this document at any time without notice.
• Suitability for Use: Nexperia products are not designed for use in life support or safety-critical systems. Use in such applications is at the customer's own risk.
• Export Control: This document and the items described may be subject to export control regulations.